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RELIFE RL-044 BGA Reballing Stencil For iPhone Samsung Huawei Xiaomi Mobile Mainboard IC Chip Repair Tin Template Soldering Kit Item NO.: 23243423
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| Product Name | RELIFE RL-044 BGA Reballing Stencil For iPhone Samsung Huawei Xiaomi Mobile Mainboard IC Chip Repair Tin Template Soldering Kit |
| Item NO. | 23243423 |
| Weight | 0.3 kg = 0.6614 lb = 10.5822 oz |
| Category | Repair Tools |
| Tag | RELIFE RL-044 |
| Brand | LIGHTSPEED |
| Creation Time | 2024-03-15 |
RELIFE RL-044 BGA Reballing Stencil For iPhone Samsung Huawei Xiaomi Mobile Mainboard IC Chip Repair Tin Template Soldering Kit
Warranty Service
All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.
Please refer to the guide to get a RMA and initiate an after sales claim.
Scope of Warranty
● Order-related issues: Incorrect quantity, incorrect products and package damage.
● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.
● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.
After Sales Service Process
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