Home>Repair Tools>Phone Repair Tools>Mijing M21 Universal BGA Reballing Stencil Magnetic Base for The Middle Layer BGA Tin Planting Phone Motherboard Repair
Mijing M21 Universal BGA Reballing Stencil Magnetic Base for The Middle Layer BGA Tin Planting Phone Motherboard Repair

Mijing M21 Universal BGA Reballing Stencil Magnetic Base for The Middle Layer BGA Tin Planting Phone Motherboard Repair Item NO.: 1005005636458014

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Product Name Mijing M21 Universal BGA Reballing Stencil Magnetic Base for The Middle Layer BGA Tin Planting Phone Motherboard Repair
Item NO. 1005005636458014
Weight 0.25 kg = 0.5512 lb = 8.8185 oz
Category Repair Tools > Phone Repair Tools
Creation Time 2023-06-01

Mijing M21 Universal BGA Reballing Stencil Magnetic Base for The Middle Layer BGA Tin Planting Phone Motherboard Repair

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process


 

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