Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>Mijing KC8 Mobile Phone CPU NAND Glue Removal Blade Motherboard BGA Chip Scraper Pry Knife Rear Glass Disassembly Hand Tools
Mijing KC8 Mobile Phone CPU NAND Glue Removal Blade Motherboard BGA Chip Scraper Pry Knife Rear Glass Disassembly Hand Tools

Mijing KC8 Mobile Phone CPU NAND Glue Removal Blade Motherboard BGA Chip Scraper Pry Knife Rear Glass Disassembly Hand Tools Item NO.: 23011472

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Product Name Mijing KC8 Mobile Phone CPU NAND Glue Removal Blade Motherboard BGA Chip Scraper Pry Knife Rear Glass Disassembly Hand Tools
Item NO. 23011472
Weight 0.05 kg = 0.1102 lb = 1.7637 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Brand MIJING
Creation Time 2023-08-26


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Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

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