MJ Medium temperature high temperature tin paste for Phone NAND Flash CPU wifi chip ic Planted tin BGA repair solder paste Item NO.: 817251_817256

US$ 2.45 ~ US$ 2.67

Quantity	0-10	11-50	≥51
Discount	2% OFF	5% OFF	8% OFF
Price	US$ 2.61	US$ 2.53	US$ 2.45

Model

temperature: Low temperature Medium temperature

Quantity: Stock ( 5344 )

Product Name	MJ Medium temperature high temperature tin paste for Phone NAND Flash CPU wifi chip ic Planted tin BGA repair solder paste
Item NO.	817251_817256
Weight	0.5 kg = 1.1023 lb = 17.6370 oz
Category	Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag	BGA reballing kit
Creation Time	2023-02-26

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