MJ CPU Stencil For Huawei Series BGA Kirin HI CPU WTR WFR dislocation hole Item NO.: 818523

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Product Name	MJ CPU Stencil For Huawei Series BGA Kirin HI CPU WTR WFR dislocation hole
Item NO.	818523
Weight	0.01 kg = 0.0220 lb = 0.3527 oz
Category	Phone Parts > Motherboard parts
Tag	Motherboard parts
Creation Time	2023-02-26

Product Name	MJ CPU Stencil For Huawei Series BGA Kirin HI CPU WTR WFR dislocation hole
Item NO.	862261
Smart device Brand	Huawei
BGA reballing kit	Stencil
Weight	0.02kg = 0.0441 lb = 0.7055 oz
Category	Parts Consumables> Motherboard parts
Tag	HUAWEI Mate8 HUAWEI Mate9 HUAWEI Mate10 HUAWEI Mate9PRO HUAWEI Mate10Pro HUAWEI P9 HUAWEI P10 HUAWEI P20 Honor V10 P20CPU 20PRO CPU MATE10CPU 10PRO CPU RSCPU 10CPU V10-KIRIN 970CPU HI3670CPU P10CPU CPU Stencil 10PCPU MATE9CPU 9PROCPU NOVA2SCPU 9CPU V9-KIRIIN960CPU HI3660CPU MT8CPU P9CPU-HI CPU HI Power CPU EMMC CPU EMCP-QUALCOMM WTR IC CPU WTR3925 WTR4905 Hi6522 hi6555 HI6523 Huawei stencil HI6250 HI6220 HI3670 HI3660 HI6620 MJ CPU stencil MJ stencil WTR5975 HI6422 WTR2965 WTR2955 Mijing stencil honor V9 mt8 Honor 9 Kirin960 KIRIN970 Huawei CPU stencil BGA153 BGA254 Mijing CPU stencil HW-1 HW-2 HW-3 HW-4 Huawei P20 pro Huawei RS Honor 10 Huawei P10P Huawei Nova2 HI CPU HI3660B HI3660A HI6421A HI6421B HI6551 HI6421GFC HI6553 BGA162 HI6561 BGA221 BGA169 WTR1625 WTR1625/L WTR3905 WFR1620 WTR4605 WFR2600 WTR2605 WTR2100 BGA186 WTR1605/L Dislocation hole 0.35 0.45 0.4 0.4/45 0.35/45
Brand	Mijing
Creation Time	2019-03-29

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