Home>Phone repair tools>BGA reballing kit>Applicable to Samsung ZFLIP4 mid-layer tin planting network SM-F721U/B/n/0/d/w/be/w7023 A Mao Yixiu
Applicable to Samsung ZFLIP4 mid-layer tin planting network SM-F721U/B/n/0/d/w/be/w7023 A Mao Yixiu

Applicable to Samsung ZFLIP4 mid-layer tin planting network SM-F721U/B/n/0/d/w/be/w7023 A Mao Yixiu Item NO.: 21961052

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Product Name Applicable to Samsung ZFLIP4 mid-layer tin planting network SM-F721U/B/n/0/d/w/be/w7023 A Mao Yixiu
Item NO. 21961052
Weight 0 kg = 0.0000 lb = 0.0000 oz
Category Phone repair tools > BGA reballing kit
Creation Time 2023-04-26

Product Name Applicable to Samsung ZFLIP4 mid-layer tin planting network SM-F721U/B/n/0/d/w/be/w7023 A Mao Yixiu
Item NO.2237627
BGA reballing kit Stencil
Weight 0.04 kg = 0.0882 lb = 1.4110 oz
Category Phone repair tools> BGA reballing kit
Tag Stencil. Samsung. SM. AMAOE. TIN PLANTING. ZFLIP4. mid-layer. tin planting network. F721U
Brand AMAOE
Creation Time 2023-04-21

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● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

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