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Amaoe Middle Layer BGA Reballing Stencil for Phone 11Pro Max A13 CPU Steel Network IC Chip Solder Tin Planting Net

Amaoe Middle Layer BGA Reballing Stencil for Phone 11Pro Max A13 CPU Steel Network IC Chip Solder Tin Planting Net Item NO.: 3256805735002536

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US$ 6.90
Color
11p pm 0.1 11p pm 0.12 11p pm 0.15 11Pro PM-A13 IP11 0.1 IP11 0.12 IP11 0.15 A13 CPU 0.12mm A13 RAM 0.10mm A13 RAM 0.12mm A13 CPU 0.10mm Full Carved CPU 0.12 Tail Board
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Product Name Amaoe Middle Layer BGA Reballing Stencil for Phone 11Pro Max A13 CPU Steel Network IC Chip Solder Tin Planting Net
Item NO. 3256805735002536
Weight 0.1 kg = 0.2205 lb = 3.5274 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Brand AMAOE
Creation Time 2023-09-13

Amaoe Middle Layer BGA Reballing Stencil for Phone 11Pro Max A13 CPU Steel Network IC Chip Solder Tin Planting Net

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process


 

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