Home>Repair Tools>Amaoe HI3690 BGA Reballing Stencil for Huawei mate30Pro CPU Chip Tin Planting Soldering Net 0.12mm Square Hole Phone Repair Tool
Amaoe HI3690 BGA Reballing Stencil for Huawei mate30Pro CPU Chip Tin Planting Soldering Net 0.12mm Square Hole Phone Repair Tool

Amaoe HI3690 BGA Reballing Stencil for Huawei mate30Pro CPU Chip Tin Planting Soldering Net 0.12mm Square Hole Phone Repair Tool Item NO.: 1005005482121821

Write a Review
US$ 6.75
Color
5g lower layer HI3690 upper layer HI3690 lower layer HU3
Quantity

Copy and share this link on social network or send it to your friends

Copy
Product Name Amaoe HI3690 BGA Reballing Stencil for Huawei mate30Pro CPU Chip Tin Planting Soldering Net 0.12mm Square Hole Phone Repair Tool
Item NO. 1005005482121821
Weight 0.1 kg = 0.2205 lb = 3.5274 oz
Category Repair Tools
Creation Time 2023-06-01

Amaoe HI3690 BGA Reballing Stencil for Huawei CPU IC Chip Tin Planting Soldering Net 0.12mm Square Hole Phone Repair Tool

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process


 

No related record found