Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>AMAOE QU:5 Qualcomm CPU reballing stencil 0.12MM SDM845 SM8150 SDM670 SDM710 MSM8917 SM6150 QU5 CPU steel mesh 0.12MM
AMAOE QU:5 Qualcomm CPU reballing stencil 0.12MM SDM845 SM8150 SDM670 SDM710 MSM8917 SM6150 QU5 CPU steel mesh 0.12MM

AMAOE QU:5 Qualcomm CPU reballing stencil 0.12MM SDM845 SM8150 SDM670 SDM710 MSM8917 SM6150 QU5 CPU steel mesh 0.12MM Item NO.: 21406837

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US$ 2.24 ~ US$ 2.44
Quantity 0-10 11-50 ≥51
Discount 2% OFF 5% OFF 8% OFF
Price US$ 2.39 US$ 2.31 US$ 2.24
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Product Name AMAOE QU:5 Qualcomm CPU reballing stencil 0.12MM SDM845 SM8150 SDM670 SDM710 MSM8917 SM6150 QU5 CPU steel mesh 0.12MM
Item NO. 21406837
Weight 0 kg = 0.0000 lb = 0.0000 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag BGA reballing kit
Brand AMAOE
Creation Time 2023-02-26

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process


 

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